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Air Environment Aligner Product List

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Atmospheric Environment Aligner "EG-303 Series"

Edge grip type aligner that does not contact the back surface of the wafer for 300mm wafers.

■High-precision centering with edge grip method using three movable claws ■Minimization of robot waiting time during alignment with optional buffer port *For more details, please refer to the PDF document or feel free to contact us.

  • Transport and handling robots
  • Air Environment Aligner

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Atmospheric Environment Aligner "OFH-4100 Series"

[For 50-300mm wafers] A suction holding type aligner that achieves the industry's shortest alignment time.

■ Multiple sizes of wafer alignment are possible with the upper command. ■ The orifice and notch can be stopped at specified positions (using wafer ID reading). ■ Compatible with quartz wafers as well. * For more details, please refer to the PDF document or feel free to contact us.

  • Transport and handling robots
  • Air Environment Aligner

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